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GP2W1001YP0F GP2W1001YP0F irda compliant transceiver module 9.6 kb/s to 4 mb/s (fir) low profile low consumption current applications 1. mobile equipment (cellular phone, pager, smart phone, pdas, portable printer, etc. ) 2. digital imaging equipment (digital camera, photo imaging printer) 3. pos equipment 4. personal computers 5. personal information tools notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification she ets before using any sharp device. sheet no.: e3-a00102en date apr.02.2007 ?sharp corporation description the GP2W1001YP0F is an infrared transceiver module for irda ver. 1.4 (fir). the transceiver consisits of a pin-photo diode, infrared emitter and control ic in a single package. features 1. compliant with the irda 1.4 (fir) transmission speed : 9.6 kb/s to 4 mb/s transmission distance : 1 m 2. small package l 10.0 w 4.38 h 3.53 mm 3. peak emission wavelength : 880 nm 4. side view type 5. soldering reflow type 6. shield type 7. low consumption current due to shutdown function (consumption current at shutdown mode : max. 1.0 a) 8. operates from 2.7 to 5.5 v 1 agency approvals/compliance 1. compliant with iec60825-1 class 1 eye safety standard 2. compliant with rohs directive (2002/95/ec) 3. content status of six substances specified in ? management methods for control of pollution caused by electronic information products regulation ? (popular name : china rohs ) (chinese : ? ? ?? ) ; refer to page 13 4. lead (pb) free device
GP2W1001YP0F block diagram outline dimensions (unit : mm) 2.9 0.3 3.53 0.3 0.9 0.3 2.36 0.3 3.6 3.8 10.01 0.3 4.38 0.3 3.88 0.3 2.36 1 1 0.4 5.8 p0.95 9=8.55 p0.95 9=8.55 1.6 1.33 1.33 1.2 1.2 1.2 3.2 +0.3 ? 0.2 10-0.49 +0.2 ? 0.3 2.05 +0.3 ? 0.2 10-0.65 1 2 3 4 5 6 7 8 9 10 bottom view center of detector center of emitter product mass : approx. 0.15g terminal symbol analog ground agnd channel select f_sel mode select 0 md0 mode select 1 md1 digital ground dgnd receiver signal output rxd transmitter signal input txd led anode leda cmp rxdrv txdrv logic pd led dvcc amp 20 av cc agnd f _ sel md0 md1 dv cc dgnd rxd txd leda sheet no.: e3-a00102en 2 1) area: au plating 2) unspecified tolerance shall be 0.2 mm 3) adhesion of resin to the terminal area shall be allowed max. 0.2 mm.
GP2W1001YP0F 1.8 2.75 2.2 0.05 1.4 0.875 0.925 0.475 1.425 2.375 3.325 0.65 4.275 : solder paste area dimensions are shown for reference. please open the solder mask as below so that the size of solder creamed paste for this device before reflow soldering must be as large as one of the foot pattern land indicated for reference. (unit : mm) recommended pcb foot pattern recommended size of solder creamed paste (reference) 1.8 2.75 2.2 0.05 1.4 0.875 0.925 0.65 0.475 1.425 2.375 3.325 4.275 1.18 1 2 3 4 5 6 7 8 9 10 terminal symbol analog ground agnd channel select f_sel mode select 0 md0 mode select 1 md1 digital ground dgnd receiver signal output rxd transmitter signal input txd led anode leda ? dimensions are shown for reference (unit:mm) sheet no.: e3-a00102en 3
GP2W1001YP0F electro-optical characteristics (ta=253c, v cc =3.30.1v, 50.1v, ambient illuminance of detecting face:10 lx or less) *1 refer to fig. 2, 3 absolute maximum ratings (ta=25c) note) transmission signal duty ratio show the time share of h level of transmission wave at tx terminal. the frequency shall be 1khz or more. symbol rating unit supply voltage v cc 6v led supply voltage v leda 6v transmission signal duty ratio d u 50 % peak forward current i fm 600 ma operating temperature t opr -10 to +70 DD 1.2 ma rxout:h,txin:l,v cc =5.0v DD 1.5 ma rxout:h,txin:l,v cc =3.3v D 0.1 1 a rxout:h,txin:l,v cc =5.0v D 0.2 2 a receiver wakeup time t rsd DD 1.5 ms sir:9.6k to 115.2kb/s 0.04 D 5000 fir:1.152m/4mb/s 0.1 D 5000 rxout terminal "l" level v ol v cc =3.3,5.0v DD 0.4 v rxout terminal "h" level v oh v cc =3.3,5.0v v cc -0.4 DD v t rra sir:9.6k to 115.2kb/s DD 200 t rrb fir:1.152m/4mb/s DD 40 t fra sir:9.6k to 115.2kb/s DD 200 t frb fir:1.152m/4mb/s DD 40 peak receive wavelength rx D 940 D nm t w1 sir mode,9.6kb/s *1 1 D 22 s t w2 sir mode,115.2kb/s *1 1 D 4 s t w3 fir mode,1.152mb/s *1 110 D 500 ns t w4 fir mode,4mb/s (single) *1 85 D 165 ns maximum receive distance l *1 1 DD m peak emission wave length tx 850 880 900 nm i el low power D 15 D middle power D 60 D full power( Q 15) 100 D 500 txin terminal "l" level v il1 v cc =3.3,5.0v DD v cc 0.2 v txin terminal "h" level v ih1 v cc =3.3,5.0v v cc 0.67 DD v i il txin=gnd -0.1 0 0.1 i ih txin=v cc =5.0v DD 50 logic terminal "l" level v il2 terminal f sel,mid0,md1 v cc =3.3,5.0v DD DD v output radiant rise time t rtx DD 40 ns output radiant fall time t ftx DD 40 ns txin terminal input current a fall time ns rxout terminal pulse width radiant intensity mw/sr receive sensitivity( Q 15) s rx ), v cc =5.0v(r l =5.6 ) led peak current i ccp current consumption at shutdown mode D 4
GP2W1001YP0F (ta=25c) truth table input txd (transmitter) high w o l w o l x high low ? on off on off off receiver state of led (transmitter) rxd terminal output x:do not care *1 f _ sfl 0:reset latching state of txd, and turn to rxa channel. *2 when a power supply is on, f _ sfl should be low. *3 when communication starts from rxb channel mode, once select rxa channel mode and change rxb channel mode. *4 rxa:rxa channel mode:115kb/s or less (sir 115.2kb/s, 9600b/s) *5 rxb:rxb channel mode:115kb/s or more (fir 1.152mb/s, 4mb/s) md0 1 0 0 1 0 0 1 0 0 1 0 0 1 0 1 1 x 0 0 1 1 0 1 1 1 0 x x 0 1 x x x x shut down rxa rxa rxb rxb shut down hpw mpw x x lpw hpw mpw lpw ? txo output high power mode txo output middle power mode latch txd latch txd txo output low power mode txo output high power mode txo output middle power mode txo output low power mode md1 f_sel txd rxd terminal mode txo remarks *2 input output logic table recommended operating conditions sheet no.: e3-a00102en 5 parameter symbol rating unit supply voltage v cc 2.7 to 5.5 v led supply voltage v led 2.7 to 7.0 v operating temperature t opr 0 to +70 data rate br 9.6k to 4m b/s
GP2W1001YP0F fig.1 recommended external circuit 10 av cc agnd dv cc dgnd rxd txd + md0 md1 leda f_sel + v led vcc (note)1. component chooses the most suitable constant of c 1 ,c 2 ,c 3 ,c 4 and c 5 according to the noise level and noise frequency of a power supply. depending on the noise level of a power supply, and noise frequency, a noise may be unable to be removed only by capacitor of a standard circuit. at this time, pulses other than a signal may be outputted from a rxd terminal in a specific communication distance. please confirm with the system that it is satisfactory with each transmission speed in all communication distance at the time of examination. when there is a noise ingredient which cannot be removed only by c 1 ,c 2 ,c 3 , please insert r x (1 to 10 ) and it after a check. when there is a problem, please use it after a check as a noise measure circuit. 2.don?t connect an avcc terminal with power supply because it is the connection of only capacitor. components recommended values c 1 ,c 2 1.0 f10%(note) c 3 4.7 f10%(note) r x 1 to 10 1/8w c 4 5.6 f10%(note) c 5 0.1 f10%(note) r l 2.0 5% 1/2w (v led =3.3v) 5.6 5% 1/2w (v led =5.0v) c 1 c 2 c 3 r x r l c 4 c 5 sheet no.: e3-a00102en 6
fig.2 output waveform specification(receiver side)(c l 10pf) t f t w t r 90% 50% 10% v oh v ol transmitter * l e e : light detector face illuminance < 10 lx : indicates horizontal and vertical directions. GP2W1001YP0F oscilloscope the light emitting diode (sharp gl710 , p =850 to 900nm) is used as the transmitter, where the following continuous signals are transmitted. in fig.3, output signal shall be complete receiver side electro-optical characteristics. t 1 radiant intensity t 2 fig.3 standard optical system(receiver side) GP2W1001YP0F data rate t 1 t 2 t 2 /t 1 radiant intensity 9.6kb/s 104 s19.53 s3/16 40mw/sr 115.2kb/s 8.68 s1.63 s3/16 40mw/sr 1.152mb/s 868ns 217ns 1/4 100mw/sr 4mb/s 500ns 125ns 1/4 100mw/sr * sheet no.: e3-a00102en 7
t f t r i e fig.4 output waveform specification(transmitter side) fig.5 standard optical system(transmitter side) : indicates horizontal and vertical directions. GP2W1001YP0F detector for radiant intensity measuring fig.6 recommended circuit of transmitter side GP2W1001YP0F leda 1.63 s br=115.2kb/s tx GP2W1001YP0F v in tx=2.8v dv cc =3.3v,r l =2.0 90% 10% sheet no.: e3-a00102en 8
fig.7 peak forward current vs. ambient temperature GP2W1001YP0F ambient temperature ta ( ) -25 0 25 50 75 100 0 peak forward current i fm (ma) 70 -10 600 400 200 pulse width 22 s, duty ratio 1/4 sheet no.: e3-a00102en notes (1) when the system (program) is designed, the turn around time shall be secured by considering 500 s or more that is specified to irda. then, this turn around time means the time when this device does not temporarily detect the signal light, since the transmitted light form the transceiver reaches the detector side of the transceiver. (2) as it is necessary 1.5 ms or more (at ta =25 c, no input signal) to return from shut-down mode to ready- operation mode, please consider this point at the system (program) designing. also, please confirm thoroughly the operation in actual application. (3) when there is much external disturbing light source is located near this transceiver and the detector face resceiver much external disturbing light, there is case that the pulse other than signal output is generated as noise on output terminal of this transceiver. please consider the lay-out and structure to reduce disturbing light on the detector face. (4) in case that this sensor is adopted in ir communication system, please use it according to the signal method which is specified by [serial infrared physical layer link specification version 1.4] published by infrared data association. false operation may happen if the different signal method is used. (5) in circuit designing, make allowance for the degradation of light emitting diode output that results from long continuous operation. ( 50 % degradation/5 years) 9
GP2W1001YP0F max 60s max 5s max 160s max 115s 40s to 90s 1. in case of solder reflow please carry out only one time soldering at the temperature and the time within the temperature profile as shown in the figure below. 2. other precautions 3. soldering soldering method 1 to 3 /s 1 to 3 /s 1 to 5 /s an infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. so keep the package temperature within that specified in item 1. also avoid immersing the resin part in the solder. even if within the temperature profile above, there is the possibility that the gold wire in package is broken in case that the deformation of pcb gives the affection to lead pins. please use after confirming the conditions fully by actual solder reflow machine. ? soldering iron shall be less than 25w, and temperature of point of soldering iron shall use at 260 or less. ? soldering time shall be within 5s. ? soldered product shall treat at normal temperature. 225 max 195 25 max 245 sheet no.: e3-a00102en 10
GP2W1001YP0F package specification tape and reel package 2000 pcs/reel name material counter measure for esd reel ppe coped(conductivity) carrier tape pc coped(conductivity) cover tape pet coped(conductivity) carrier tape structure and dimensions dimension list taping materials c a d e f g h i b k j l m abcde f 16.00.3 7.50.1 1.750.1 8.00.1 2.00.1 4.00.1 gh i j klm 1.5 +0.1 -0.0 10.60.1 4.00.1 4.00.1 0.330.05 4.60.1 4.10.1 sheet no.: e3-a00102en 11 (unit : mm)
GP2W1001YP0F reel structure and dimensions direction of product insertion d e a b c g f abcd 3302 17.51 1001 130.2 efg 210.8 22.50.1 20.5 pull out direction lens side sheet no.: e3-a00102en 12 (unit : mm)
GP2W1001YP0F sheet no.: e3-a00102en 13 cleaning instructions solvent cleaning : solvent temperature 45 or less, immersion for 3 min or less ultrasonic cleaning : the effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, pcb size or device mounting condition etc. please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. the cleaning shall be carried out with solvent below. recommended solvent materials : ethyl alcohol, methyl alcohol, isopropyl alcohol presence of odc etc. ? ? ? infrared data communication device ? ? ? category toxic and hazardous substances lead (pb) mercury (hg) cadmium (cd) hexavalent chromium (cr 6+ ) polybrominated biphenyls (pbb) polybrominated diphenyl ethers (pbde) this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbb and pbde are not used in this product at all. ? the rohs directive (2002/95/ec) this product complies with the rohs directive (2002/95/ec). object substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb) and polybrominated diphenyl ethers (pbde) ? content of six substances specified in ? management methods for control of pollution caused by electronic information products regulation ? (chinese : ? ? ?? ) ? : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in sj/t 11363-2006 standard.
GP2W1001YP0F important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. s harp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. contact sharp in order to obtain the latest device specifi- cation sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliab ility. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following condi- tions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copy- right laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this pu blication. sheet no.: e3-a00102en 14

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